Memory Packaging Pathfinding Architect -Gen AI
Listed on 2026-10-16
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Engineering
Systems Engineer, Packaging Engineer
Micron Technology is seeking a senior technical lead in packaging pathfinding for next generation memory systems, spanning from data centers to edge-AI. You will guide long-term package technology directions and partner with customers to turn ideas into scalable products, interfacing across package process tech, materials, electrical, thermo-mechanical and system performance areas.
You will collaborate with silicon and system design teams and customers to boost speed performance for edge-AI and
The Memory Packaging Pathfinding Architect for Next-Gen AI role at Micron Technology is now open for applications in San Jose, CA, United States.
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This posting is for the Memory Packaging Pathfinding Architect for Next-Gen AI role at Micron Technology, based in San Jose, CA, United States.
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