Advanced Packaging​/Process Engineer of R&D

It's fun to work in a company where people truly BELIEVE in what they're doing! We're committed to bringing passion and customer focus to the business. If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

About Lumentum At Lumentum, we’re building the tech behind the world's fastest networks and most advanced systems. Our optical and photonic solutions power everything from AI and cloud computing to data centers, telecom, and advanced manufacturing. We're a global team of innovators working where light meets technology, solving big challenges that keep the world connected and moving forward. If shaping the future of connectivity excites you, you'll fit right in.

Lumentum Operations LLC is seeking a Staff Advanced Packaging/Process Engineer for R&D to drive the development of cutting‑edge packaging solutions for optical and photonic devices. This role involves innovating and optimizing processes for high-performance, reliable, and cost-effective packaging.

Lead the design, development, and optimization of advanced packaging processes for new optical and photonic products, from concept to high-volume manufacturing. Conduct hands-on process development, characterization, and troubleshooting for various packaging technologies, including die attach, wire bonding, flip-chip, optical alignment, hermetic sealing, and advanced interconnection schemes. Develop and implement robust process control strategies, statistical process control (SPC), and design of experiments (DOE) to improve yield, reliability, and manufacturability.

Collaborate closely with cross‑functional teams including design, product engineering, reliability, and manufacturing to ensure seamless transfer of new packaging technologies into production. Evaluate and select new materials, equipment, and manufacturing techniques to enhance packaging performance, reduce cost, and improve throughput. Perform root cause analysis for packaging-related failures and implement corrective actions. Document process specifications, manufacturing instructions, and test procedures. Mentor junior engineers and provide technical leadership within the R&D team.

Stay abreast of industry trends, emerging technologies, and competitive landscapes in advanced packaging.

Education:

Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline.

Experience:

Core Requirements: 8+ years of experience in advanced packaging or process engineering within the optoelectronics, photonics, or semiconductor industry, with a strong R&D focus. Demonstrated expertise in multiple packaging technologies such as chip‑on‑board (COB), flip‑chip, wafer‑level packaging (WLP), system‑in‑package (SiP), hermetic sealing, and optical assembly. Proficiency with various bonding techniques (e.g., wire bonding, thermocompression bonding, epoxy attach). Strong understanding of materials science principles relevant to packaging, including adhesives, solders, encapsulants, and substrates.

Hands‑on experience with packaging equipment, including pick‑and‑place, wire bonders, reflow ovens, and optical alignment systems. Solid knowledge of statistical process control (SPC), design of experiments (DOE), and failure analysis techniques. Experience with CAD tools for package design and simulation is a plus. Excellent problem‑solving, analytical, and communication skills. Ability to work independently and collaboratively in a fast‑paced R&D environment.

• Flexible time off
• Health and wellness benefits (physical and mental)
• Tuition reimbursement and career growth support
• A workplace built for you: free gym,…