Principal Mechanical Engineer, Advanced Packaging & Thermal
Listed on 2026-10-17
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Engineering
Mechanical Engineer, Packaging Engineer, Product Engineer
AMD’s advanced packaging organization seeks a Principal Mechanical Engineer to shape mechanical architecture for next‑gen HPC, AI, and semiconductor products. You will lead concept definition, mechanical design, simulation, qualification, and manufacturing ramp, influencing product direction across package, server, and rack systems.
You will mentor engineers, drive CAD design and thermal‑mechanical FEA, and partner with cross‑functional teams to deliver robust cooling solutions and high‑quality
Consider building your career as a Principal Mechanical Engineer, Advanced Packaging & Thermal at AMD.
Are you ready to take on the Principal Mechanical Engineer, Advanced Packaging & Thermal role at AMD?
We would love to welcome a new Principal Mechanical Engineer, Advanced Packaging & Thermal to our organisation in San Jose, CA, United States.
For the Principal Mechanical Engineer, Advanced Packaging & Thermal position at AMD, we are reviewing applications now.
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