Signal Integrity Engineer: .5D/3D Interconnects & Sign-Off
Listed on 2026-10-18
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Engineering
Electronics Engineer, Systems Engineer, Electrical Engineering, Test Engineer
Broadcom Inc. in San Jose, CA seeks an experienced SI/PI engineer to drive sign-off for next‑gen ASIC interconnects, including 2.5D/3D packaging. You will perform timing sign‑offs, EM extraction, and PDN/PDN analysis, collaborating with R&D, IP, customers, and manufacturing partners.
The role blends AE and R&D duties, requires TCL/Python scripting, and experience with DDR/LPDDR or HBM SI/PI sign-off flows. Base salary ranges from USD 143,800 to 230,000 plus equity and benefits.
We are currently recruiting a Signal Integrity Engineer: 2.5D/3D Interconnects & Sign-Off for our team in San Jose, CA, United States.
Step into the Signal Integrity Engineer: 2.5D/3D Interconnects & Sign-Off role at Broadcom Inc. in San Jose, CA, United States and grow with us.
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