Mechanical Engineer II: Hardware Packaging & Thermal Design
Listed on 2026-10-18
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Engineering
Packaging Engineer, Mechanical Engineer, Manufacturing Engineer, Hardware Engineer
Cisco is seeking a Mechanical Engineer to drive detailed mechanical design, BOM management, and cross-functional collaboration from feasibility to manufacturing. You will work with hardware, ECAD, and test assurance teams to deliver robust, manufacturable packaging solutions.
The role emphasizes design for manufacturing, reliability testing, and close coordination with thermal engineers and suppliers to optimize costs and performance.
This role is for the Mechanical Engineer II:
Hardware Packaging & Thermal Design role at Hardware FYI.
Our organisation is growing, and we are hiring a Mechanical Engineer II:
Hardware Packaging & Thermal Design in San Jose, CA, United States.
This opening is for the Mechanical Engineer II:
Hardware Packaging & Thermal Design role at Hardware FYI.
We are seeking a motivated Mechanical Engineer II:
Hardware Packaging & Thermal Design to join Hardware FYI in San Jose, CA, United States.
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