Product Reliability Engineer - Silicon One

The application window is expected to close on: 11/19/2026 The role operates as onsite work model in San Jose, California.

Join the Silicon Operations Quality & Reliability team at the core of Cisco's next-generation hardware and networking strategy. Our mission is to ensure the long-term reliability and physical integrity of Silicon One ASICs—the industry-leading silicon architectures powering modern AI data center clusters and hyperscale networks. We are a collaborative, highly technical group of semiconductor, packaging, and reliability engineers who partner closely with ASIC design, test operations, and global foundry partners.

It is an opportunity to work at the bleeding edge of semiconductor technology—validating massive, high-power ASICs built on advanced sub-5nm fabrication nodes and complex 2.5D/3D multi-die packaging technologies.

As a Product Reliability Engineer, you will own the end-to-end reliability qualification lifecycle for our flagship Silicon One ASICs to guarantee world-class performance and field readiness. You will apply your semiconductor engineering and physics foundation to validate new silicon designs, advanced packaging, and foundry fabrication processes. Operating in a highly visible multi-functional environment, you will collaborate with ASIC design, test engineering, manufacturing operations, and external testing laboratories to resolve complex technical challenges and eliminate quality risks before mass production.

• Own and execute end-to-end reliability test plans for new products from initial silicon bring-up through full production qualification, including coordination with Bay Area external test laboratories.
• Assess integrated circuit (IC), package, and process reliability against industry standards by managing critical evaluations such as HTOL, HAST, ESD (HBM/CDM), and Latch-up testing.
• Lead cross-functional failure analysis (FA) and root-cause investigations to drive corrective actions and prevent future silicon defects.
• Analyze reliability datasets, life acceleration models, and burn-in trends to evaluate field readiness and validate new silicon nodes and packaging technologies.
• Deliver comprehensive qualification reports and risk assessments to engineering partners and leadership to support production release milestones.

Bachelor’s degree in Electrical Engineering, Materials Science, Microelectronics, Physics, or a related technical field (or equivalent practical experience).

3+ years of experience in semiconductor product reliability, manufacturing/assembly, test processes, supply chain, and failure analysis.

Strong understanding of semiconductor manufacturing, IC test methodologies, device reliability, and common silicon/package failure mechanisms.

Hands-on experience with accelerated life testing, reliability estimation, and reliability testing of semiconductor components and modules.

Proficiency in statistical data analysis, ATE data interpretation, electrical characterization, IC failure analysis, and multi-functional collaboration to analyze yield loss and device failures.

• Experience qualifying devices fabricated on advanced semiconductor process nodes (sub-7nm/5nm/3nm) or using advanced packaging technologies (2.5D/3D, multi-die, chiplets).
• Direct experience managing qualification test execution, hardware development, and scheduling with external third-party testing laboratories.
• Practical knowledge of physical failure analysis techniques (e.g., SEM, TEM, FIB, EMMI, OBIRCH, X-ray) to identify physical root causes of device failures.

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