Thermal Design Engineer - Lead Principal HRCFlexible

## Thermal Design Engineer
- Lead Principal San Jose, CAApply Now Use AI to find out how well you match with this jobJob :
HRC
1652399

Job family:
Research & Development Workplace type:
hybrid

Join as:
Professional#We Are In  for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks?
As a Thermal Design Engineer
- Lead Principal  on our Research & Development team, you'llhave the opportunity to merge creativity with your technical expertise byshaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Areyou in?

Your role  Key responsibilities in your new role
* Lead thermal design and development of advanced semiconductor power solutions, including
** IVR, VRM**, and
** power module
** platforms* Architect thermal management solutions for high power-density products utilizing liquid cooling, cold plates, manifolds, heat sinks, and TIM materials
* Perform detailed thermal simulations using
** ANSYS Icepak, FloTHERM, FEAtools,
** and
* * CFD
* * methodologies* Develop and optimize mechanical designs using Solid Works for thermal assemblies and packaging solutions.
* Conduct steady-state and transient thermal analysis to improve performance, reliability, and manufacturability.
* Evaluate and select thermal interface materials (TIMs), cooling technologies, and advanced materials for semiconductor applications.
* Partner cross-functionally with electrical, package, reliability, manufacturing, and systems engineering teams.
* Drive
** prototype builds**,
** thermal validation**, and correlation between simulation and lab data.
* Mentor junior engineers and provide technical leadership across thermal engineering initiatives.
* Influence product roadmap decisions related to thermal performance, packaging, and system integration.  

Your profile  Qualifications and skills to help you succeed
* Bachelor’s or Master’s degree in Mechanical Engineering or related discipline. PhD is a plus.
* 8-10+ years of thermal/mechanical design experience within the semiconductor, power electronics, or advanced electronics cooling industry.
* Expert proficiency in Solid Works for 3D mechanical design.
* Strong hands-on experience with
** FloTHERM, ANSYS Icepak**, and
** Finite Element Analysis (FEA)
** tools.
* Deep knowledge of liquid cooling systems, including cold plates,manifolds, pumps, and coolant flow optimization.
* Experience designing heat sinks, vapor chambers, TIM interfaces, and package level
** thermal solutions**.
* Strong understanding of semiconductor packaging constraints,reliability, and manufacturability.
* Ability to lead programs independently and communicate effectively with executive and technical teams.  
** Additional information
** Infineon Technologies is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, family care status, military or veteran status, marital status, domestic partner status, sexual orientation, or any other basis protected by local, state, or federal laws.

Employment at Infineon is contingent upon proof of your legal right to work in the United States under applicable law, verification of satisfactory references, successful completion of a background check and drug test, and signing all your on-boarding  some instances, if applicable, U.S. export control laws require that Infineon obtain a U.S. government export license prior to releasing technologies to certain persons.

This offer is contingent upon Infineon's…