R&D Principal Engineer Novel Materials and Integration Solutions

About the Role

Join our Corporate Research team in San Jose as an R&D Principal Engineer focused on developing novel materials and integration solutions for advanced semiconductor devices and 3D structures. In this role, you will work hands-on across materials synthesis, thin-film deposition, cleanroom fabrication, and advanced characterization to support next-generation IC technologies. You will collaborate with internal teams in San Jose and Taiwan, as well as university research partners, to explore new materials, devices, and thermal integration approaches for future semiconductor innovation.

You will join us in our San Jose office, operating on a hybrid work schedule with 4 days in-office.

Responsibilities

• Research and develop novel materials and integration solutions for future devices and IC thermal management applications.
• Synthesize and deposit materials using CVD, ALD, PVD, and related techniques.
• Fabricate devices and test structures using cleanroom processes such as lithography, etching, deposition, metallization, and bonding.
• Characterize materials, interfaces, and devices using structural, chemical, electrical, optical, and thermal analysis methods.
• Analyze experimental data and prepare technical reports.
• Collaborate with internal cross-functional teams and external research partners.
• Conduct research at both in-house and off-site facilities.

Minimum Qualifications

• Ph.D. in Physics, Materials Science, Chemistry, Electrical Engineering, or a related field.
• Experience in materials synthesis and thin-film deposition using CVD, ALD, PVD, or related growth methods.
• Hands-on experience with cleanroom processing, device fabrication, and characterization techniques.
• Strong knowledge of materials science, surface chemistry, thin-film growth, etching, planarization, and bonding.
• Ability to work independently and collaborate with cross-functional teams.

Preferred Qualifications

• Experience in semiconductor device design, fabrication, integration, and advanced testing.
• Experience with thermal characterization of materials, structures, or interfaces.
• Experience setting up research equipment or programming for tool control and data collection.
• Experience in data analysis and technical reporting.
• Familiarity with physics-based simulation tools.

Company Description

Join TSMC Technology, Inc. (TTI), an innovation hub of Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC has been a pioneer in the semiconductor industry since 1987. With teams located in San Jose, CA, and Austin, TX, TTI is dedicated to advancing semiconductor technology through expertise in physical design, memory design, analog mixed signal, power management, and groundbreaking computational AI machine learning research.

Our mission is to drive the future of semiconductor innovation through unparalleled R&D and customer-focused IP. Be part of a team that shapes the next generation of technological advancements.

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

• The world’s leading dedicated semiconductor foundry
• The technology leader with a strong reputation for manufacturing excellence
• Advancing semiconductor manufacturing innovations to enable the future of technology

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as…