Advanced Packaging Design Engineering Team Leader; Hybrid

This position requires that you live within commuting distance of our San Jose, CA office and commute to the office 4-5 days per week.

Cisco Silicon One (#Cisco Silicon One ) is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best-of-breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.

We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies. Come join us and take part in shaping Cisco's ground-breaking solutions by designing, developing and testing some of the most complex ASICs being developed in the industry!

This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. As a technical and team leader, you will drive complex package design programs—from planning and optimization to execution—ensuring the delivery of high-speed, robust, and scalable solutions for global networks.

You will lead and grow the San Jose package design team, mentoring engineers and developing future package leads while collaborating closely with layout, SI/PI, silicon architecture, and manufacturing partners. Your leadership will ensure the delivery of high-quality package designs aligned with system-level requirements.

Beyond technical leadership, you will help shape methodologies, improve development flows, and strengthen cross-functional collaboration across Cisco’s global silicon organization, while fostering a culture of collaboration, accountability, and continuous improvement.

• Lead complex package design programs, planning and driving schedules from concept through implementation and tapeout.
• Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance, manufacturability, and reliability.
• Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and system-level alignment.
• Work closely with layout editors and implementation teams to deliver high-quality package layouts aligned with interface and manufacturing requirements.
• Serve as the technical and organizational leader of the San Jose package design team, providing direction, mentorship, and technical guidance to engineers.
• Develop and grow package design capability within the team, mentoring engineers and enabling them to take ownership of increasingly complex package programs.
• Coordinate resources across designers, layout editors, and contractors to support efficient project execution.
• Enhance package design methodologies and partner with vendors to improve product quality and efficiency.
• Drive innovation in package solutions for Cisco’s next-generation ASIC platforms.

• Bachelor’s degree in electrical engineering or a related field with 12+ years of work experience or Master’s degree in Electrical Engineering or a related field with 8+ years of work experience
• Experience in high-speed package design, including signal integrity considerations and power distribution networks (PDN).
• Experience with industry-standard EDA tools for package layout and design.
• Experience with technical leadership in complex…