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Senior Packaging Design Engineer - TSV OSAT & Interconnects

Job in Santa Clara, Santa Clara County, California, 95053, USA
Listing for: nEye Systems, Inc.
Full Time position
Listed on 2025-12-14
Job specializations:
  • Engineering
    Electrical Engineering, Manufacturing Engineer, Packaging Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 200000 - 260000 USD Yearly USD 200000.00 260000.00 YEAR
Job Description & How to Apply Below
A leading semiconductor solutions provider in California seeks a Packaging Design Engineer to lead the development of advanced semiconductor packaging. This position involves designing high-reliability packaging processes, collaborating with foundry partners, and qualifying OSAT assembly processes. The ideal candidate should possess a degree in Electrical or Mechanical Engineering and have over 5 years of experience with semiconductor packaging and interconnects.

The annual salary ranges from $200,000 to $260,000, commensurate with experience.
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Position Requirements
10+ Years work experience
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