Etch process engineer

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting‑edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next‑generation technology, join us to deliver material innovation that changes the world.

Salary: $ - $

Location:

Santa Clara, CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about benefits.

• Perform plasma etch (SYM3/ICP etch) process development on a variety of difficult systems.
• Perform Root Cause Analysis and resolve a variety of difficult process engineering issues.
• Generate internal and external documentation for products, presentations and technical reports.
• Interact with internal modules (WET/CMP/Lithograph/Deposition/Integration) to resolve a variety of process engineering issues/problems with limited supervision.
• Design and implement new technology, products and analytical instrumentation. Utilize techniques to characterize hardware, define methods and apply new technologies to characterize hardware, and/or perform hardware characterization on a wide range of complex systems for multiple products, within safety guidelines.
• Implement new technology, products and analytical instrumentation. Travel may be required.

• Ph.D. degree or foreign equivalent in Materials Science, Chemistry, Chemical Engineering, Physical Chemistry, Physics related field and 10 years of experience in the position offered or related process engineering position.
• Plasma etch, including Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP) etch tools.
• Strong understanding of semiconductor manufacturing processes and industry standards including deposition, etch, lithography and metrology.
• Design of experiments (DOE) to resolve complex materials analysis problems.
• Statistical analysis methods and tools.

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field.

• Interprets internal/external business challenges and recommends best practices to improve products, processes or services.

• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity.

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions.

• Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies.

• Communicates difficult concepts and negotiates with others to adopt a different point of view.

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:
Yes, 20% of the Time

Relocation Eligible:
No

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job‑related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

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