Co-Founder​/Chief Technology Officer; Advanced Packaging & Test​/OSAT Equity

Position: Co-Founder / Chief Technology Officer (Advanced Packaging & Test / OSAT+) - Equity only in the [...]
Co-Founder / Chief Technology Officer (Advanced Packaging & Test / OSAT+) - Equity only in the beginning -> Salary after funding

2 days ago Be among the first 25 applicants

Title:

Co-Founder / Chief Technology Officer – Advanced Packaging and Test (Outsourced Semiconductor Assembly and Test for Artificial Intelligence)

Location note:

Primary hub:
Santa Clara, California (Hybrid)

Also very open to candidates currently in the Folsom / Sacramento area and the Phoenix / Chandler / Tempe, Arizona region.

I am building Next Zen Forge – a new kind of advanced packaging and test platform (Outsourced Semiconductor Assembly and Test, also known as OSAT) focused on the bottleneck of the artificial intelligence hardware world:

• Seventy‑two‑hour Failure Analysis (FA) for Graphics Processing Unit (GPU) and High Bandwidth Memory (HBM) modules

• Time‑boxed New Product Introduction (NPI) pilot attach windows

• Auditable, data‑transparent quality that hyperscalers and artificial intelligence chip startups actually trust

We will start with a Failure Analysis and pilot New Product Introduction lab in Folsom / Sacramento, then scale attach and test capacity in Arizona, and later add a support hub in another location (if needed)

I am looking for a Co-Founder / Chief Technology Officer with deep experience in advanced packaging who wants to help architect this from day zero.

You will own

• Designing and qualifying attach, underfill, reflow, clean, inspection, and reliability flows for Graphics Processing Unit / High Bandwidth Memory, flip‑chip ball grid array, and two‑and‑a‑half‑dimensional / three‑dimensional assemblies

• New Product Introduction through to ramp: designing Design of Experiments, running first‑article and qualification lots, driving Statistical Process Control, and owning yield and Overall Equipment Effectiveness targets

• Tool and facility decisions for the Folsom / Sacramento Failure Analysis lab and the first Arizona attach and test line (Mechanical, Electrical, and Plumbing loads, layouts, and vendor selection)

• Technical customer interface with artificial intelligence chip companies, hyperscalers, memory vendors, and original equipment manufacturers

• Building and mentoring the first engineering team (New Product Introduction, reliability, Failure Analysis technicians, quality)

You might be a fit if

• You have 10–20+ years in advanced semiconductor packaging, module engineering, or Failure Analysis at an Outsourced Semiconductor Assembly and Test provider or device maker

• You have personally taken High Bandwidth Memory, interposer, chiplet, or flip‑chip packages from New Product Introduction into volume production

• You are comfortable specifying and qualifying C‑Mode Scanning Acoustic Microscopy, Automated X‑ray Inspection, underfill and attach tools, and you know how to read yield and defect paretos in your sleep

• You want to be a true co‑founder, not just an employee

Compensation (founder‑level)

• Equity only at the beginning:
Based on experience and commitment

• After the first external funding round: salary in the range of 240,000–300,000 United States Dollars, plus bonus and benefits

• Hybrid between Santa Clara and Folsom / Sacramento, with some travel to Arizona as the attach and test line ramps

About me

I am Santanu, Founder and Chief Executive Officer of Next Zen.ai and Next Zen Security LLC. My background is in cybersecurity, trust, and systems. I am combining that with your deep packaging experience to build an advanced packaging platform designed for speed, transparency, and security from day one.

How to reach me

• Message me here on Linked In, or

• Three bullet points describing ramps you have led

• A short outline of your ideal eight‑week pilot attach program

• Your top five “must‑have” tools for a Graphics Processing Unit / High Bandwidth Memory attach line

If this sounds like the challenge you have been waiting for, I would love to talk.

Seniority Level

• Executive

Employment Type

• Full‑time

Job Function

• Business Development and Sales

Industries

• Information Services

Referrals increase your chances of interviewing at Next Zen AI by 2x

#JLjbffr