Sr Engineer Field Application Engineering

About Global Foundries:
Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

The Global Foundries Field Application Eng (FAE) engages with GF's Power technology (BCD & leading edge technologies like 22

FDX and Finfet) customers early to assess customer technical needs and identify the best GF technical solution to satisfy those needs driving the opportunity to DWIN and on towards tapeout. The FAE should understand and surmount any barriers of adoption the client may have for using GF technologies for their product development. FAE will work cross functionally with internal GF technical experts in pursuit of converting these opportunities to revenue.

• Engage with customers to understand their technical needs towards development of their semiconductor IC products.
• Assess the competitive landscape to identify and advocate winning GF value propositions.
• Partner internally with GF account managers, product marketing, and technical experts in the creation of compelling, application specific presentations to describe how GF technology solutions can help those customers develop their industry winning products.
• Work closely with the account management team to merge technical and commercial terms into a design winning proposal.
• Identify and resolve all issues / concerns to convert the DWIN into product Tapeout.
• Where competitive gaps exist, advocate internally for improved features and capabilities of GF solutions to close such gaps.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Education – Bachelors or Masters degree in electrical engineering or equivalent (e.g. applied physics, etc).
• Experience – Minimum 5 yrs in semiconductor design, tapeout and process.
• Skills – Working knowledge of IC chip design flows and tools from architectural definition through performance characterization for BCD and leading edge technologies like 22
  
  FDX and Finfet. Technical Program Management, active thinking, positive attitude, problem solving, strong responsibility and ownership, teamwork and personal communication skills are critical.
• Travel
  - Up to 20%, primarily domestic with some international travel.
• Fluency in English Language – written & verbal

• Education – Master’s or PhD in electrical engineering or equivalent.
• Experience – 5 yrs in semiconductor product design at the chip or module level and preferably in RF Design.
• Skills
  - Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization.
• Exposure/Experience in one or more of Digital / Analog Mixed Signal/HV Power/eNVM/Millimetre Wave IC product design highly desirable.
• SoC product integration/design experiences highly desirable.
• Project management skills - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.

Expected Salary Range $67,000.00 - $ The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at  and let us know the nature of your request and…