Senior Field Applications Engineer - Packaging & Projects
Listed on 2026-10-07
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Engineering
Packaging Engineer, Systems Engineer, Electronics Engineer
Tata Electronics Private Limited (TEPL) seeks a Senior Technical Program Manager to support the VP of field application engineering. Must have hands-on semiconductor packaging experience including flip chip, bumping, and wafer-level packaging; coordinate with RnD, NPI, SCM, and Production to ensure successful customer projects.
Strong communication, problem-solving, and collaboration skills are essential to build trust and drive milestones in a fast-paced environment.
Step into the Senior Field Applications Engineer
- Packaging & Projects role at Tata Electronics in Santa Clara, CA, United States and grow with us.
As a Senior Field Applications Engineer
- Packaging & Projects, you will play an important part at Tata Electronics in Santa Clara, CA, United States.
We invite applications for the Senior Field Applications Engineer
- Packaging & Projects position located in Santa Clara, CA, United States.
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