Memory Packaging Engineer — Drive -Gen -BW
Listed on 2026-10-07
-
Engineering
Packaging Engineer
Apple Inc. in Santa Clara, CA is seeking a Memory Packaging Engineer to architect memory solutions powering high-performance hardware.
You will guide package roadmaps, collaborate with internal teams, and own the product lifecycle from concept through qualification. The ideal candidate has a bachelor's degree in a related field; advanced degrees and 3+ years in high-density memory packaging, wirebond/flip-chip experience, and solid reliability know-how are preferred.
We are looking to fill the Memory Packaging Engineer — Drive Next-Gen High-BW Packages position at Apple Inc. in Santa Clara, CA, United States.
As a Memory Packaging Engineer — Drive Next-Gen High-BW Packages, you will play an important part at Apple Inc. in Santa Clara, CA, United States.
We invite applications for the Memory Packaging Engineer — Drive Next-Gen High-BW Packages position located in Santa Clara, CA, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).