Data Center Packaging Engineering Leader
Listed on 2026-10-13
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Engineering
Packaging Engineer
AMD is seeking a visionary leader to drive the design execution of next-generation Data Center GPU and MI package programs. You will guide cross-functional teams across design, SI/PI, OSAT partners, and management to deliver high-performance, high-complexity packages on aggressive timelines.
The role emphasizes AI-enabled methodologies, process innovation, and collaboration with global teams to scale execution and ensure manufacturability and yield optimization.
Consider building your career as a Data Center Packaging Engineering Leader at AMD.
As a Data Center Packaging Engineering Leader, you will play an important part at AMD in Santa Clara, CA, United States.
We invite applications for the Data Center Packaging Engineering Leader position located in Santa Clara, CA, United States.
The following opening is for a Data Center Packaging Engineering Leader with AMD.
Our team is growing, and we are hiring a Data Center Packaging Engineering Leader in Santa Clara, CA, United States.
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