Senior Packaging Failure Analysis Engineer
Listed on 2026-10-13
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Engineering
Quality Engineering, Materials Engineering
About Us
nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company’s Super Switch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.
Position SummaryWe are seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigation of complex failures across our silicon photonics, MEMS, optical packaging, and electronic assemblies.
This role will have a particular focus on cross-sectioning bonded components and analyzing material interfaces, including adhesive/epoxy attach, fusion and eutectic bonding, solder interconnects, and hermetic packages. The ideal candidate combines a strong foundation in materials science and interfacial phenomena with deep practical experience in failure analysis, microscopy, analytical characterization, and sample preparation.
You will own investigations from initial non-destructive analysis through destructive physical analysis, determine the appropriate characterization technique for each problem, translate findings into actionable root cause and corrective actions, and feed learnings back into product design, packaging, manufacturing, and supplier processes.
Over time, this individual may also play a key role in building and expanding in-house failure analysis capabilities, including cross-sectioning/polishing, microscopy, SEM/EDS, and related analytical infrastructure.
Key Responsibilities
Lead structured failure analysis and root-cause investigations across silicon photonics, MEMS, optical packaging, bonded assemblies, and PCBAs.
Perform and interpret cross-sections of bonded structures and material interfaces, identifying defects, intermetallic formation, diffusion, cracking, voiding, contamination, delamination, and other failure mechanisms.
Develop FA workflows using the appropriate progression of non-destructive and destructive analytical techniques, including optical microscopy, X-ray/CT, SAM, IR imaging, cross-sectioning, FIB, SEM/EDS, XPS, XRD, and related methods.
Apply a strong understanding of materials science, phase diagrams, interfacial reactions, and failure mechanisms to interpret analytical results—for example, identifying phase formation within Au-Si or other bonded interfaces.
Understand the capabilities, limitations, detection depths, spatial resolution, and appropriate application of different analytical and metrology techniques and select the best method for each investigation.
Analyze fusion and eutectic bonded interfaces, including Si-Si, Si-glass, Au-Sn, and Au-Si systems, for unbonded regions, particle-induced voids, cracking, weak-bond propagation, and other interfacial defects.
Investigate photonics fibre/FAU attach and adhesive failures, including coupling-loss shifts, alignment drift, delamination, voiding, cure shrinkage, creep, photo darkening, and out gassing.
Support epoxy/material selection and characterization, including CTE, modulus, Tg, refractive index, ionic content, and cure kinetics, using techniques such as DSC and FTIR.
Investigate solder and PCBA failures, including voiding, non-wet opens, head-in-pillow, pad cratering, IMC growth, fatigue cracking, warpage, and reflow-related defects.
Support hermeticity and MEMS failure investigations, including leak testing, moisture ingress, contamination, stiction, cavity pressure shifts, and out gassing-driven drift.
Perform or coordinate mechanical characterization including die shear, fibre pull,…
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