Advanced Packaging Integration Engineer

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

Salary: $ - $

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Join the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross‑functional research team to develop advanced packaging solutions for next‑generation smart glasses and high‑performance optical interconnects.

As an Advanced Packaging Integration Engineer
, you will lead process integration for high‑performance interconnects and micro‑LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, suppliers, and cross‑functional teams across Applied Materials and external partners. You will work closely with design, process, integration, and metrology teams to deliver production‑ready solutions.

• Define, develop, execute, andoptimizeadvanced packaging process integration flows (e.g., hybrid bonding, 2.5D/3D heterogeneous integration), to ensure the highest possible product performance, yield, and reliability.
• Own, manage, and drive complex technical projects, track progress and solve roadblocks to ensure on time delivery with high quality.
• Design experiments, systematically collect and analyze data, drive root‑cause analysis and implement corrective actions.
• Collaborate with foundries, OSATs, and internal research teams to define and implement improved integration strategies and methodologies.
• Stay abreast of the latest field advancements. Apply such knowledge to drive innovations.

• Ph.D. or M. S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
• In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding,…