Lead .5D/3D Packaging AI Data Centers
Listed on 2026-10-15
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Engineering
Packaging Engineer
Phizenix Inc. seeks an Advanced 2.5D/3D/Chiplet packaging Lead to direct Signal Integrity for package, PCB and system design for copper interconnects beyond 200G.
Lead 2.5D/3D and heterogeneous packaging development for co-packaged driver, TIA and optical engines, including substrate architecture, interposer evaluation, and die–package co-design. Own OSAT/substrate supplier strategy, PDN and thermal design, and signoff criteria.
Step into the Lead 2.5D/3D Packaging for AI Data Centers role at Phizenix Inc. in Santa Clara, CA, United States and grow with us.
The Lead 2.5D/3D Packaging for AI Data Centers position in the Marketing & Media, Engineering field is open for applications.
We have an opening for a Lead 2.5D/3D Packaging for AI Data Centers in Santa Clara, CA, United States within Marketing & Media, Engineering.
This role, Lead 2.5D/3D Packaging for AI Data Centers at Phizenix Inc., could be your next move.
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