Data Center Packaging Engineering Lead
Listed on 2026-10-17
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Engineering
Packaging Engineer
Advanced Micro Devices, Inc. is seeking a experienced leader to drive end-to-end Data Center GPU and MI package design programs. You will lead cross-functional teams across design, SI/PI, and manufacturing to ensure timely, high-quality package solutions.
You will mentor and grow a high-performing team, foster accountability and innovation, and partner with OSATs and vendors to optimize yield and manufacturability. This role emphasizes leadership, collaboration, and data-driven decision making.
This is a great opportunity to take on the Data Center Packaging Engineering Lead role at Advanced Micro Devices, Inc.
Learn more about the Data Center Packaging Engineering Lead role in the description above.
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