Packaging Engineer | Career Accelerator Program
Listed on 2026-10-17
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Engineering
Packaging Engineer
Texas Instruments in Santa Clara, CA invites new graduates to join a 12-month Packaging Engineer Development program as part of the TMG Development program, with hands-on training to accelerate ramp into TI and long-term career success.
You will partner across businesses to design and develop internal and external semiconductor packaging solutions, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages, while supporting qualification, testability and reliability goals in a
We invite applications for the Packaging Engineer | 12-Month Career Accelerator Program position located in Santa Clara, CA, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Santa Clara, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 95..
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