Senior Co-Design Architect: Power, Thermal & Packaging
Listed on 2026-10-20
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Engineering
CAD/ AutoCAD/ Mechanical Design, Packaging Engineer
NVIDIA's Silicon Co-Design Group seeks a senior Co-Design Architect to push the physical limits of chips, spanning architecture, silicon, systems and manufacturing. You won't maintain existing solutions; you'll redefine what's possible and shape GPU/CPU outcomes at scale.
In this role you will identify where power, thermal and packaging constraints will erode competitiveness, and build cross‑domain, testable solutions that deliver next‑generation performance.
Our team is growing, and we are hiring a Senior Co-Design Architect:
Power, Thermal & Packaging in Santa Clara, CA, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Santa Clara, CA, United States.
This opportunity is part of our work in IT & Technology, Engineering.
The advertised compensation is 196..
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