CryoCMOS Design Director, Quantum

About Global Foundries:

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit  of Role:

The CryoCMOS Design Team Manager will lead a multidisciplinary team of approximately 10–20 analog, RF, digital, mixed-signal, and physical design engineers developing advanced cryogenic CMOS ICs and reusable design solutions. This role provides technical and people leadership across the complete IC development lifecycle, from architecture and circuit design through verification, tapeout, silicon characterization, and design-to-silicon correlation

The CryoCMOS Design Team Manager is responsible for building and leading GF's CryoCMOS IC design capability and delivering differentiated integrated circuit solutions for quantum and other advanced applications. The manager will provide technical direction, organizational leadership, and execution ownership while working closely with technology development, PDK, compact modeling, test, packaging, design enablement, customers, and ecosystem partners.

Essential Responsibilities:

Lead and manage a multidisciplinary CryoCMOS IC design team of approximately 10–20 engineers, establishing technical direction, priorities, resource plans, and execution strategy across analog, RF, digital, mixed-signal, and physical design disciplines.

Drive end-to-end development of CryoCMOS ICs and reusable design IP, from system and circuit architecture through design, simulation, physical implementation, verification, tapeout, silicon bring-up, and characterization.

Provide technical leadership for complex IC development, including architecture and design reviews, design methodology, performance optimization, design closure, technical risk identification, and resolution of critical design issues.

Develop differentiated IC solutions, reusable IP, design methodologies, and enablement capabilities that leverage GF process technologies for cryogenic, quantum, and other advanced applications.

Partner with PDK, compact modeling, technology development, test, packaging, and design enablement teams to translate process technology capabilities into robust, manufacturable IC solutions and identify design or modeling gaps.

Establish and continuously improve IC design processes, technical review mechanisms, quality standards, and execution metrics to enable predictable delivery and successful tapeouts.

Build and develop a high-performing engineering organization through recruiting, coaching, technical mentorship, performance management, succession planning, and development of future technical leaders.

Collaborate with internal stakeholders, customers, and ecosystem partners to translate system requirements and technology opportunities into design roadmaps, IC architectures, and executable development programs.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Work and collaborate on other projects and/or assignments as needed.

Required Qualifications:

Education:

Bachelor's degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field.

Experience:

Minimum 10 years of relevant semiconductor IC design experience, including progressively increasing technical leadership responsibilities.

Leadership:
Demonstrated experience successfully leading and managing IC design…