Die-to-Wafer Hybrid Bonding Module Engineer
Listed on 2026-11-04
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Engineering
Process Engineer, Electrical Engineering
Applied Materials is seeking a Die-to-Wafer Hybrid Bonding Module Engineer to develop and scale next‑generation bonding technologies for AI accelerators, memory, and chiplets.
The role leads process module development, from die preparation and surface activation to hybrid bonding, post‑bond characterization, and manufacturing scale‑up, collaborating with equipment teams and R&D partners.
We would love to welcome a new Die-to-Wafer Hybrid Bonding Module Engineer to our organisation in Santa Clara, CA, United States.
Join Applied Materials and contribute to our ongoing work.
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This posting is for the Die-to-Wafer Hybrid Bonding Module Engineer role at Applied Materials, based in Santa Clara, CA, United States.
We are looking to fill the Die-to-Wafer Hybrid Bonding Module Engineer position at Applied Materials in Santa Clara, CA, United States.
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