Principal Systems Packaging and Assembly Engineer

Thrively is partnering with an exceptionally innovative, well-funded semiconductor technology company developing breakthrough optical networking solutions for next-generation AI and high-performance computing infrastructure.

We are seeking a Principal Systems Packaging & Assembly Engineer to take a leading technical role in developing advanced semiconductor packaging architectures and assembly processes for a complex, highly integrated optical switching platform.

Reporting to the Director of Packaging, this individual will be responsible for developing and integrating packaging solutions that bring together MEMS devices, photonic ICs, ASICs, substrates, and precision optical, electrical, and mechanical interfaces.

This is a highly technical, hands-on individual contributor position combining package architecture, heterogeneous integration, assembly process development, materials engineering, reliability, and manufacturing execution.

The successful candidate will work across the complete product development lifecycle—from early architecture and prototype builds through design validation, qualification, and transfer to scalable manufacturing.

We are particularly interested in engineers who can operate comfortably at both the system/package architecture level and the detailed assembly process and manufacturing level.

Advanced Package Architecture & Integration

• Lead the design and development of advanced semiconductor packaging architectures integrating MEMS, photonic devices, ASICs, and associated electrical and mechanical components.
• Define package configurations, die placement, substrate and interposer requirements, interconnect strategies, material systems, and assembly methodologies.
• Drive heterogeneous integration approaches, including System-in-Package (SiP), multi-die packaging, and advanced 2.5D/3D packaging where applicable.
• Collaborate with photonics, MEMS, electrical, mechanical, and product engineering teams to optimize package performance, manufacturability, and reliability.
• Evaluate trade-offs involving thermal management, mechanical stress, alignment stability, interconnect density, package size, and cost.

Assembly Process Development

• Develop, optimize, and qualify semiconductor packaging and assembly processes, including die attach, flip-chip bonding, wire bonding, adhesives, underfill, and precision component assembly.
• Define assembly sequences, process flows, tooling, fixtures, equipment requirements, and manufacturing documentation.
• Lead hands-on engineering development, prototype builds, process characterization, and design-of-experiments (DOE) activities.
• Identify and resolve complex packaging challenges involving materials compatibility, CTE mismatch, warpage, interfacial reliability, and mechanical stability.
• Support the integration of precision optical and electrical interfaces within complex semiconductor assemblies.

NPI, Qualification & Manufacturing Scale-Up

• Lead packaging activities through new product introduction (NPI), engineering validation, qualification, and manufacturing readiness.
• Partner closely with external semiconductor assembly and test providers (OSATs), contract manufacturers, and equipment suppliers.
• Develop and transfer robust, repeatable assembly processes into manufacturing environments.
• Establish process controls, acceptance criteria, manufacturing specifications, and yield improvement strategies.
• Drive root-cause investigations and corrective actions for packaging, assembly, and reliability issues.
• Support manufacturing cost optimization, supplier readiness, and the transition toward high-volume production.

Technical Leadership

• Serve as a senior technical authority for package architecture, assembly integration, and packaging process development.
• Work directly with engineering leadership to establish packaging strategies and technical roadmaps.
• Provide technical direction across multidisciplinary teams and external manufacturing partners.
• Balance innovative engineering solutions with practical considerations involving manufacturability, schedule, reliability, and cost.
• Help establish the packaging infrastructure, processes, and best practices needed to support a rapidly scaling semiconductor organization.

• Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Semiconductor Engineering, or a related technical discipline.
• Extensive experience in semiconductor packaging, advanced assembly, heterogeneous…