Hybrid Bonding Module Engineer — Die-to-Wafer
Listed on 2026-11-04
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Engineering
Process Engineer, Electronics Engineer, Electrical Engineering, Materials Engineering
Applied Materials, Inc. in Santa Clara, CA, seeks a Die-to-Wafer Hybrid Bonding Module Engineer to scale next-generation hybrid bonding for advanced packaging, memory, chiplets, and AI accelerators.
You will lead process module development across die prep, surface activation, die placement, bonding, post-bond characterization, yield improvement, and manufacturing scale-up, collaborating with equipment teams, materials scientists, device architects, and customers.
The following opportunity is for a Hybrid Bonding Module Engineer — Die-to-Wafer with Applied Materials, Inc.
All applications are reviewed carefully by our team.
The position is based in Santa Clara, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 147..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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