Senior & Substrate Design Engineer
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Engineering
Job Description & How to Apply Below
Touchdown Labs is seeking a Package Design & Substrate Engineer to drive substrate stack-up, routing, and thermal integrity for high-speed compute chips. You will work closely with chip, system, and supplier teams to ensure robust packaging and testability in a fast-paced environment.
The role requires 7+ years in package/substrate design, SI/PI and thermal simulation experience, and proficiency with Cadence APD/SiP or Ansys.
The following position is for a Senior Package & Substrate Design Engineer with Touchdown Labs.
The advertised compensation is 150..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Package & Substrate Design Engineer role in the description above.
We appreciate your interest in this position.
Join Touchdown Labs and contribute to our ongoing work.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
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