Advanced Packaging Architect 5D/3D Integration
-
Engineering
Job Description & How to Apply Below
Apple, Inc. is seeking a Packaging Development Engineer in Santa Clara, CA, to drive next‑generation 2.5D/3D packaging integration and technology development.
You will define, develop, and qualify advanced packaging technologies, including hybrid bonding, interposers, fine‑pitch microbumps, and TSVs, collaborating across silicon design, thermal, and manufacturing teams. The role involves leading test vehicles, CPI/reliability assessment, and cross‑functional optimization from early architecture
The following opening is for a Advanced Packaging Architect – 2.5D/3D Integration with Apple, Inc.
The advertised compensation is 150..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Advanced Packaging Architect – 2.5D/3D Integration role in the description above.
We appreciate your interest in this position.
Join Apple, Inc. and contribute to our ongoing work.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
View / Apply for Jobs
Matching My Jurisdiction