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Hardware Tech Lead -Optomechanical Engineer

Job in Santa Monica, Los Angeles County, California, 90403, USA
Listing for: Cisco
Full Time position
Listed on 2026-10-05
Job specializations:
  • Engineering
    Systems Engineer, Mechanical Engineer
Salary/Wage Range or Industry Benchmark: 151000 - 216000 USD Yearly USD 151000.00 216000.00 YEAR
Job Description & How to Apply Below

The application window is expected to close on: 10/17/2026
Meet the Team
The Outshift by Cisco team is one of Cisco’s most innovative organizations, driving the next generation of transformative technologies and business opportunities. As part of the Strategy, Incubation & Applications group led by Cisco’s Chief Strategy Officer, you will collaborate with some of the company’s most forward-thinking researchers, engineers, and technology leaders. Within the Outshift Quantum Research team and Quantum Labs, we are pioneering the design and development of practical, scalable, and efficient quantum networking technologies — building blocks for the future Quantum Internet.

Our multidisciplinary team of scientists and engineers is dedicated to advancing the state of the art in quantum networking, distributed quantum systems, and quantum-enabled applications.
Your Impact

Role Cisco Quantum Research Team is seeking a Optomechanical Engineer to support our Quantum Experimental Team that is central to the physical realization of Cisco's deployable quantum hardware platforms. In this role:
  • You will take delicate breadboard and benchtop optical setups developed in R&D and re-engineer them into compact, vibration-isolated, and manufacturable 19-inch rack-mount chassis.
  • You will solve critical thermal expansion, structural deformation, and drift challenges, maintaining sub-micron kinematic alignment across wide operating temperature and mechanical shock/vibration profiles.
  • You will establish standardized mounting, fiber routing, and precision adjustment mechanisms that enable fast, repeatable assembly, testing, and servicing without requiring time-consuming manual alignment on customer sites.
  • Design compact, modular, and ruggedized enclosures (1U–4U chassis) for precision free-space optics, fiber-to-chip interfaces, laser sources, and photonic devices.
  • Design the layout of free-space optics, fiber-to-chip interfaces, laser sources, and photonic devices inside each enclosure capable of maintaining ultra-high alignment stability over extended operational lifespans.
  • Perform Finite Element Analysis (FEA) for structural deformation, thermal expansion (CTE matching), and heat dissipation in enclosed optical modules.
  • Design active and passive vibration isolation systems to protect sensitive optical paths from internal cooling fan vibrations and external data center acoustic/structural noise.
  • Conduct comprehensive tolerance stack-up analyses (GD&T) to guarantee optical alignment budgets and component interchangeable assembly tolerances.
  • Build, assemble, and validate initial optomechanical prototypes in the lab, testing for thermal drift, mechanical stability, optical loss, and vibration susceptibility.
  • Collaborate with optical physicists and systems engineers to characterize insertion loss, beam quality, and phase stability across environmental stress screening (ESS).
  • Work with vendors and machine shops to select specialized materials, precision machining methods, custom optical coatings, and surface finishes.
Minimum Qualifications
  • Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of related experience, or equivalent related work experience.
  • 2+ years experience in optomechanical design, precision mechanism design, or optoelectronic packaging for commercial, aerospace, or telecom applications.
  • Experience in 3D CAD (Solid Works, Creo) and FEA tools (ANSYS, COMSOL, or Solid Works Simulation) for structural, thermal, and modal analysis.
  • Experience with GD&T (ASME Y14.5), kinematic design principles, CTE matching techniques, and micron-level precision adjustment mechanisms.
  • Experience packaging free-space optics, fiber launches, photonic devices, or laser assemblies into…
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