Process Engineer – Advanced Packaging

Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world‑class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award‑winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry‑first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

This role focuses on manufacturing execution and process development in the lab, coordinating builds and driving operational excellence. It differs from the Semiconductor Integration role, which emphasizes design enablement and packaging architecture. Both roles collaborate closely on the same team but have distinct responsibilities.

As a Process Engineer in Advanced Packaging, you will develop and maintain high‑yield, high‑throughput processes for next‑generation System‑in‑Package (SiP) modules integrated with microwave and mmWave subsystems across Keysight, serving multiple industries. This role emphasizes assembly manufacturing process innovation, operational excellence, and continuous improvement. You will be a key driver in translating design concepts into scalable, high‑yield processes.

• Develop and maintain package assembly processes.
• Specify, select, and qualify new equipment for advanced packaging.
• Drive process automation and continuous improvement initiatives.
• Review new designs for manufacturability and provide actionable feedback to module designers.
• Understand process flows, product design, and performance requirements; lead manufacturing teams to deliver new products that meet performance targets.
• Lead technical development of new SiP introductions in collaboration with design, process, and manufacturing teams.
• Manage accelerated project schedules; communicate and mitigate risks effectively.
• Achieve and sustain high yields while adhering to project timelines.

• B.S., M.S., or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field.
• Strong leadership and collaboration skills to drive cross‑functional success.
• Excellent communication skills for interfacing with design, manufacturing, and customer teams.

• Design for manufacturing of electromechanical assemblies.
• Statistical process control (SPC), design of experiments (DOE).
• Thermocompression / flip‑chip bonding.
• Surface Mount Technology (SMT) processes.
• Die singulation and semiconductor fabrication processes.
• Heterogeneous integration and advanced packaging techniques.
• New technology and product introduction.

Keysight is an Equal Opportunity Employer.

Santa Rosa, CA Pay Range: MIN $128,000- MAX $