Lead PCB Designer

Kapta Space, a VC-funded early-stage startup in Seattle, WA, is breaking new ground in Geospatial Intelligence. Our technology centers around a proven, scalable electronically‑steered radar for sophisticated spaceborne applications such as earth observation using synthetic aperture radar (SAR) techniques, as well as enabling advanced defense missions such as target tracking on the ground and in the air.

Kapta Space is seeking an accomplished Lead PCB Designer to own the architecture, execution, and quality assurance of printed circuit board layouts supporting our scalable electronically‑steered radar (ESR) hardware for sophisticated spaceborne synthetic aperture radar (SAR) and advanced defense target‑tracking missions. This role blends hands‑on technical layout work with leadership of standards, design processes, and mentoring of a small team of PCB designers.

The ideal candidate will have extensive experience developing high‑speed, mixed‑signal, RF, and power boards for space or aerospace environments and thrive in a fast‑paced, multidisciplinary setting.

• Technical Ownership & Design Execution
• Lead PCB layout design for high‑speed digital, mixed‑signal, RF front‑end, and power management boards supporting spaceborne radar payloads and phased‑array antenna modules.
• In collaboration with the Responsible Engineer (RE), provide inputs to define and maintain board‑level architecture, layer stack‑ups, and routing strategies ensuring signal integrity, impedance control, and EMI/EMC compliance.
• Execute detailed component placement and routing for complex multi‑layer designs including high‑density BGAs, SERDES, DDR, FPGA, and high‑frequency RF interconnects.
• Perform full lifecycle design ownership — from schematic collaboration and layout execution through fabrication, assembly, and bring‑up support.
• Partner with RE to integrate board design within mechanical, RF, thermal, and system‑level constraints, ensuring mechanical compatibility, manufacturability, and serviceability.
• Serve as point of contact for standardized PCB layout, DFM/DFA/DFT rules, ECAD constraint management, and centralized component‑library oversight.
• Partake in formal design reviews, enforce design rules, and ensure documentation packages meet aerospace and defense standards.
• Coordinate with Contract Design Services partners to ensure alignment with internal engineering standards and deliverables. Collaborate with RE and Program Office to support PCB fabrication and assembly vendors DFM and inquiries, ensuring compliance with stack‑up, impedance, and material specifications for space/defense environments.
• Contribute to supply‑chain readiness and material qualification efforts for high‑reliability boards (e.g., polyimide, low‑out gassing, or radiation‑tolerant materials).

• Associates or Bachelor’s degree in Electrical Engineering, Computer Engineering, or related discipline (or demonstrated equivalent skills and experience.
• Significant experience of professional PCB layout experience
• Significant experience as a principal‑level individual contributor working with multi‑disciplinary engineering teams delivering complex spaceborne hardware.
• Expert proficiency in Altium Designer and strong command of constraint‑driven design.
• Understanding of impedance control, differential pair routing, grounding strategies, thermal management, and EMI/EMC mitigation.
• Significant experience with DFM/DFA/DFT principles and close collaboration with PCB fabrication and assembly vendors.
• Familiarity with aerospace or defense hardware design requirements (shock, vibration, thermal, radiation, reliability).
• Experience leading Altium toolchain integration, library management, and automation/scripting.
• Excellent communication skills, with ability to present to senior leadership and collaborate with customers and suppliers.
• Must be eligible to obtain and hold a US DoD security clearance (TS with SCI).

• Experience designing PCBs for spacecraft payloads, synthetic aperture radar systems, or electronically‑steered RF arrays.
• Proficiency with 3D ECAD/MCAD…