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Lead Encapsulation Process Development Engineer

Job in Seattle, King County, Washington, 98127, USA
Listing for: Blue Origin LLC
Full Time position
Listed on 2026-10-10
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 145188 - 203263 USD Yearly USD 145188.00 203263.00 YEAR
Job Description & How to Apply Below
Application close date:

Applications will be accepted on an ongoing basis until the requisition is closed.

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!

This role is part of Advanced Concepts and Enterprise Engineering (ACE), supporting Blue Origin’s mission of millions of people living and working in space for the benefit of Earth. The team fosters innovation and drives engineering workflows of the future, shared solutions and standards, simplicity and lower costs, and manufacturable design.

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!

About the Role You will own the encapsulation process development pipeline: from lamination and edge-sealing process recipes through inline quality verification to accelerated lifetime qualification. You will develop the process parameters, equipment configurations, and quality controls that turn packaging designs into repeatable manufacturing. You will be the bridge between packaging design intent and fabrication reality.

Responsibilities Develop lamination processes for solar module encapsulation: temperature profiles, pressure schedules, atmosphere control, and cure protocols compatible with thermally sensitive perovskite layers

Qualify encapsulant materials (EVA, POE, ionomer, silicone, thermoplastic polyurethane, etc) for compatibility — ensuring no chemical interaction with the device stack in fabrication and throughout operation.

Develop and validate thin-film encapsulation processes (PECVD, ALD-based barriers) in collaboration with other team members

Design and execute accelerated aging studies for the environments in space and on the way to the launch pad: humidity, thermal cycling, UV exposure, particle radiation, and electrostatic buildup

Optimize edge-sealing processes (desiccant-filled edge seals, laser-sealed glass, butyl rubber, UV-cure adhesives) for hermeticity and long-term reliability

Establish inline process monitoring and acceptance criteria for encapsulation steps (optical inspection, leak testing, adhesion pull tests)
Perform failure analysis on degraded or failed modules

Develop process documentation, SPC charts, and process capability studies for each encapsulation step Scale encapsulation processes from coupon-level to full module format

Interface with equipment vendors to specify and commission lamination, sealing, and barrier deposition tools

Work with your customers on the broader solar array product team to provide a product that is compatible with integration at-scale, for small (several kW) to large (100kW+) array designs

Minimum Qualifications B.Sc. Chemical Engineering, Materials Science, Mechanical Engineering, or related field5+ years of experience in encapsulation, lamination, or packaging process development for photovoltaic, OLED, or flexible electronics applications

Demonstrated experience developing lamination or sealing processes

Strong understanding of polymer processing: glass transition, crosslinking kinetics, adhesion science, and aging mechanisms

Experience with accelerated aging test design and lifetime prediction methodologies

Proficiency with process characterization tools: DSC, TGA, DMA, peel testing, optical microscopy, moisture sensors

Track record of transferring…
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