Principal ASIC Package Design Engineer: FC-BGA & MCM Lead
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Engineering
Systems Engineer, Electrical Engineering
Job Description & How to Apply Below
K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and MCM packaging for high-performance mixed-signal and digital SoCs. You will drive end-to-end package strategy, engage with vendors, and define standards to ensure first-pass success for power-dense ASICs.
Join a fast-growing, Series D-funded space tech company with a hybrid in-office requirement (3 days/week) and travel to our Torrance, CA HQ.
Our group is growing, and we are hiring a Principal ASIC Package Design Engineer: FC-BGA & MCM Lead in Seattle, WA, United States.
For the Principal ASIC Package Design Engineer: FC-BGA & MCM Lead position at K2 Space, we are reviewing applications now.
Step into the Principal ASIC Package Design Engineer: FC-BGA & MCM Lead role at K2 Space in Seattle, WA, United States and grow with us.
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