Thermal Mechanical Engineer - Icepak​/CFD

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture.

We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.

Together, we advance your career.

As a Thermal Engineer in Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering department, you will be responsible for the thermal design, validation and technology development for the AMD Data Center GPU products in this expanding and strategic market for AMD. To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, validation, and manufacturing and leaders within AMD, our customers, and our partners.

The Thermal Engineer on the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized. They will be market savvy and comfortable in a fast-paced, multi-tasking environment.

The Thermal Engineer on the Thermal Mechanical Engineering team will be responsible for the end-to-end development and delivery of thermal and/or mechanical solutions for the GPU and associated platforms. The successful candidate will have a thermal and mechanical development background with silicon level or system level experience. They will integrate into a global development team in delivering commercially viable products (silicon to systems) to the marketplace in a timely and cost-effective manner.

• Design thermal solutions to enable AMD's next generation of Datacenter GPUs
• Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to design thermal-mechanical solutions from chip level to system level
• Contribute to the overall product cycle from conceptualization through mass production
• Work in a dynamic and fast-paced product development environment
• Thermal validation of thermal-mechanical hardware at chip, card and system level
• Identify and investigate novel thermal technologies and work with vendors and internal teams to evaluate the technologies for alignment to the AMD product roadmap
• Drive process improvements while executing fast time-to-market on products.

• Strong background in heat transfer and fluid dynamics with emphasis on electronics thermal management. Thorough understanding of electronics cooling technologies;
  Air cooling and liquid cooling.
• CFD – Experience with CFD for liquid cooled systems with Icepak or similar tools is required. CFD experience in ANSYS Icepak or AEDT is a plus.
• CAD – Experience with Solid Works and/or Creo is required. Ability to implement liquid cooling designs in Creo or Solid Works for CFD analysis is a plus.
• Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
• Rack level and Datacenter and server level design experience.
• Experience developing liquid cooling solutions including design of cold plates, liquid interconnects, implementing quick disconnects, hoses, and manifolds.
• Lab
  
  Skills:
  
  Experience with design of experiments, instrumentation, data acquisition, and data analysis, including uncertainty analysis.
• Programming
  
  Skills:
  
  Ability to write scripts in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development.
• Excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve…