Thermal Engineering Intern: AI & HPC Cooling Innovator
Listed on 2026-10-13
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Engineering
Engineering Design & Technologists, Mechanical Engineer, Test Engineer
Advanced Micro Devices, Inc. (AMD) invites ambitious Mechanical Engineering students for a Thermal Engineering intern/co-op role in Santa Clara, CA. You’ll work on cooling technologies for AI and HPC platforms, gaining practical experience across testing, modeling, and data analysis.
You will engage in lab work, develop automation scripts, and contribute to design improvements while collaborating with experienced engineers. This is a full‑time internship/coop with hybrid/onsite options.
For the Thermal Engineering Intern: AI & HPC Cooling Innovator position at Advanced Micro Devices, Inc., we are reviewing applications now.
Step into the Thermal Engineering Intern: AI & HPC Cooling Innovator role at Advanced Micro Devices, Inc. in Secaucus, NJ, United States and grow with us.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
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