ASIC Eng Co-op: Design, Yield & Innovation
Listed on 2026-11-05
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Engineering
Packaging Engineer, Manufacturing Engineer, Quality Engineering, Electronics Engineer
AMD is seeking a highly motivated ASIC Packaging intern/co-op to join our team, working with engineers to bring new packaging technology to reality. You will help with substrate, interposer, and bump designs, and support design verification across projects.
The role involves learning packaging processes, analyzing yield metrics, and collaborating with partners to optimize cost and performance. This is an onsite/hybrid internship spanning multiple 2027 terms.
Are you ready to take on the ASIC Package Eng Co-op:
Design, Yield & Innovation role at Advanced Micro Devices, Inc.?
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the ASIC Package Eng Co-op:
Design, Yield & Innovation role in the description above.
We appreciate your interest in this position.
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