Semicon Equipment Engineer - UP AWS + VB North
Job in
Serangoon, Singapore
Listed on 2026-05-08
Listing for:
Consortium for Clinical Research and Innovation Singapore
Full Time
position Listed on 2026-05-08
Job specializations:
-
Engineering
Manufacturing Engineer, Process Engineer, Quality Engineering, Automation Engineering -
Manufacturing / Production
Manufacturing Engineer, Quality Engineering, Automation Engineering
Job Description & How to Apply Below
Semicon Equipment Engineer - UP $4100 + Allowance + AWS + VB, Serangoon North
US MNC Semicon
Job Details:
- Location:
Serangoon North - Salary: $3,100 Basic to $4,100 Basic + Shift Allowance + AWS + VB
- Working Hours:
- Shift 2: 2:45pm to 11:15pm
- Shift 3: 11:45pm to 7:15am
Job Scope:
- Perform machine performance validation on semiconductor packaging equipment through machine calibration, setup and testing based on defined work procedures.
- Provide level 1 support to identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
- Support Process Engineer to develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) to ascertain machine performance and integrity.
- Support Process Engineer in development and enhancement of process recipes, process tooling or manufacturing processes; inclusive of updating and enhancing work procedures.
- Ensure and validate all necessary fixtures, jigs, drawings, and work instructions are available for manufacturing processes.
- Ensure timely input of manufacturing test data and support report output on machine quality.
Requirements:
- Diploma in Engineering (Materials Science, Electrical, Mechanical or equivalent) with minimum of 3 years of related experience.
- Strong interest in statistical analysis skillset with demonstrated ability to conduct design-of-experiment.
- Proficiency in JMP or Minitab is a plus.
- Experience in handling semiconductor capital equipment GUI and hands‑on experience in process development of advanced packaging processes (die attach, TCB, FOWL or FC) will be advantageous.
- Demonstrate flair in handling data analyzer, data processing tool (Excel, etc.) and word processing tools will be advantageous.
For more details and to apply, please contact the recruiting team.
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