Onsite HPDC Tooling Engineer — Boost Die & Uptime
Listed on 2026-10-20
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Engineering
Manufacturing Engineer, Quality Engineering
Software Placement Group in Northeast Wisconsin is seeking an experienced Tooling Engineer to support the development, design, troubleshooting and continuous improvement of HPDC dies in a high-volume manufacturing environment.
This onsite role collaborates with production and engineering teams to improve die uptime, quality and life, with a base salary in the $95k–$120k range and relocation assistance for qualified candidates.
We are currently recruiting a Onsite HPDC Tooling Engineer — Boost Die Life & Uptime for our team in Sheboygan, WI, United States.
Join Software Placement Group and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Onsite HPDC Tooling Engineer — Boost Die Life & Uptime role at Software Placement Group, based in Sheboygan, WI, United States.
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