Researcher in Temporary Bonding Processes

Elevate your career as a Postdoctoral Researcher with a focus on Temporary Bonding Processes at Université de Sherbrooke. Contribute to pioneering FOWLP innovations for semiconductor technology.

Under the guidance of Professors Dominique Drouin and Serge Ecoffey, this postdoctoral project merges academia and industry through the IBM/NSERC Alliance. You will explore bonding techniques, select appropriate release tapes, and develop detailed bonding processes for high-performance chips. Your work will play a vital role in improving microelectronic packaging solutions.

Key Responsibilities:

• Review methods and materials for temporary bonding processes

• Identify commercial release tape options for evaluations

• Develop thorough bonding and debonding strategies

• Conduct rigorous morphological and mechanical characterizations

• Collaborate with IBM engineers to ensure process integrity

Requirements:

• PhD in mechanical engineering or related field

• Cleanroom microfabrication experience required

• Expertise in advanced electronic packaging

• Effective communication in English or French

• Strong collaborative and adaptive skills

Take part in innovative research and drive advancements in temporary bonding technologies within a dynamic team.
#J-18808-Ljbffr