Backend Process Engineer

• To be responsible for wafer back-end processes like dicing, sorting, top/bottom/facet AOI, frame creation, tape/detape, wafer/frame cleaning, etc.

• Monitors process performance using SPC, inspection yield, defect pareto, false-call/escape metrics, and equipment health indicators; maintains process control and responds to excursions.

• Maintains especially AOI/dicing/sorting stepwise yield and investigates defect excursions, nuisance defects, false rejects, and defect escapes; develops and implements corrective and preventive actions.

• Develops, characterizes, optimizes, and releases process recipes for semiconductor laser facet inspection, including lighting, focus, image acquisition, inspection regions, thresholds, algorithms, and defect classification criteria.

• Develops and maintains control plans, OCAPs, inspection specifications, defect libraries, golden samples, acceptance criteria, and recipe change-control documentation.

• Plans and executes engineering experiments, gauge studies, correlation studies, and capability analyses to improve defect detection sensitivity, repeatability, reproducibility, and discrimination between true defects and cosmetic variation.

• Correlates process results with manual microscope inspection, downstream electrical/optical test, reliability results, and failure analysis to validate inspection effectiveness and reduce risk of defect escapes.

• Drives continuous improvement activities to reduce scrap and reinspection, improve process capability and throughput, reduce cycle time and cost, and increase automated disposition where technically justified.

• Partners with Equipment Engineering and suppliers to troubleshoot image quality, motion, optics, illumination, software, recipe, and hardware issues and to support qualification of equipment upgrades or new inspection capability.

• Supports new product introduction and process changes by defining inspection requirements, establishing baseline defect signatures, qualifying recipes, and completing process readiness documentation.

• Trains Process Technicians, Operators, and Engineers on facet inspection methods, AOI/dicing/sorting recipes, defect classification, reaction plans, and proper handling of inspected material.

• Collaborates with Operations, Equipment Engineering, Process Integration, Design, Quality, Reliability, Failure Analysis, and Supply Chain to achieve business unit and organizational objectives.

Required Minimum Education:

4 year college degree (Bachelor or Equivalent)

Expected Minimum Years of Related

Experience:

2+ years

• A bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, Optics/Photonics, Computer Engineering, or a closely related science or engineering major and at least 2 years of relevant experience in semiconductor, optoelectronics, precision inspection, machine vision, or automated manufacturing; or a Master or PhD degree in a related field without industry experience.

• Experience with semiconductor laser devices, GaAs/InP processing, optical microscopy, machine vision, or automated optical inspection is preferred.

• Working knowledge of semiconductor wafer/device processing, engineering practices, and manufacturing process control.

• Deep Knowledge of automated optical inspection (AOI), machine vision, optical microscopy, image acquisition, lighting, focus, and defect detection concepts.

• Ability to develop and optimize recipes, thresholds, regions of interest, defect classifiers, and acceptance criteria for high-volume manufacturing.

• Knowledge of engineering statistics including SPC, DOE, process capability, measurement system analysis, gauge R&R, correlation, and hypothesis testing.

• Ability to analyze inspection…