Section Manager - Process Development; SM
Job in
Sherman, Grayson County, Texas, 75091, USA
Listed on 2026-10-19
Listing for:
Texas Instruments
Full Time
position Listed on 2026-10-19
Job specializations:
-
Engineering
Process Engineer, Systems Engineer, Operations Management
Job Description & How to Apply Below
Job-:
Manufacturing
Location:
United States;
Sherman, TX, United States Posted:
Shift/
Work Schedule:
1stECL/GTC
Required:
Yes Why Texas Instruments At Texas Instruments, we design and manufacture semiconductors that power electronics across the world. Our 300mm manufacturing facilities represent some of the most advanced wafer fabrication environments in the industry. We invest in our people, our technology, and our manufacturing capabilities and we are looking for leaders who want to make a meaningful impact ut the Role Texas Instruments is seeking a technically strong and highly motivated Section Manager - Process Development to lead a cross-functional team of experienced process engineers developing TI's most advanced analog semiconductor technologies.
In this leadership role, you will drive innovative process development across all process modules, manage concurrent technology programs, and deliver solutions that push the boundaries of analog technology performance.
This is a high-visibility position requiring both deep technical expertise and strong people leadership. You will partner closely with integration, device, design, and manufacturing teams to define and execute process development strategies delivering results on aggressive timelines in a fast-paced, high-impact environment.
What You'll DoTeam Leadership & Organization Management Lead, develop, and grow a cross-functional team of experienced process engineers spanning all major process modules
Drive workforce planning, performance management, succession planning, and talent development within the section
Foster a culture of technical excellence, innovation, accountability, and continuous improvement
Advanced Process Development Lead process development and optimization across all process modules including Photolithography, CVD, PVD, Diffusion, Plasma Etch, CMP, and other relevant unit processes
Define and execute process integration strategies for TI's most advanced analog technology nodes
Drive innovative process solutions that meet performance, reliability, and manufacturability requirements
Own technical problem-solving and root cause resolution for complex, cross-module process challenges
Program Execution & Timeline Management Enable multiple concurrent technology development programs, balancing resources and priorities to meet aggressive milestones
Support program schedules, clearly communicating status, risks, and mitigation plans to site and executive leadership
Drive cross-functional execution across process engineering, integration, device engineering, equipment, and operations teams to ensure on-time technology delivery
Develop scalable engineering workflows and operational frameworks that improve program velocity and team effectiveness
Cross-Functional Collaboration & Executive Engagement Partner with integration, yield, device, and operations teams to ensure seamless technology transfer and process readiness
Provide regular program updates, technology development status, and risk assessments to site leadership
Represent the section in cross-site and corporate-level technology forums, benchmarking activities, and best-practice sharing initiatives
Qualifications
Minimum requirements:
Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.
5 years of direct engineering team leadership or management experience within the semiconductor industry.
Preferred qualifications:
Broad process module experience spanning multiple unit process areas within an advanced wafer fabrication environment
Experience leading technology development for analog, mixed-signal, or specialty semiconductor technologies
Familiarity with process integration and technology transfer to high-volume manufacturing
Track record of delivering new technology nodes or process generations on schedule and to performance specifications
Experience in 300mm wafer fabrication environments
Experience supporting multi-site or corporate-level technology benchmarking and governance
Strong cross-functional collaboration, communication, and project management skills
Proven ability to engage and present program and technology updates to site and executive leadership
About the organization TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this…
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