Manager, Process Engineering; Electroplating
Listed on 2026-10-15
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Engineering
Process Engineer, Electronics Engineer, Materials Engineering, Chemical Engineering
Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore's Advanced Packaging Development Center (APDC) team. This role will lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications. The successful candidate will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products and technology solutions.
Key ResponsibilitiesManage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products
Manage, develop, plan and execute process engineering projects for entire range of products
Interact with key customers to resolve significantly complex process engineering issues for entire range of products
Develop and implement new technology, products and analytical instrumentation
Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products
Contributes to market share gains through technology improvement
Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
8+ years of semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition technologies.
Strong knowledge of copper plating, wafer‑level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
Experience collaborating with customers and cross‑functional teams to resolve complex technical challenges.
Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.
Science Park II (Moving to Tampines office starting Apr 2027)
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