Principal​/Staff Engineer, PCVD Film Deposition, TD

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

We are seeking a highly motivated engineer to join our Technology Development team focused on advanced thin film deposition processes for next-generation memory technologies. This role spans responsibilities from process development to technical leadership, depending on experience level (Principal/Staff) .

• Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures
• Design and execute complex DOE experiments to improve process capability, uniformity, and reliability
• Perform in-depth root-cause analysis using advanced modeling and characterization techniques
• Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges
• Drive innovation in film deposition for improved performance, cost efficiency, and sustainability
• Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles
• Define technology roadmaps and lead strategic research initiatives. Generate intellectual property and influence future deposition technology directions
• Mentor junior engineers and lead multi-disciplinary technical projects

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

• Ph.D / Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
• Master with minimum 8 years or PhD with minimum 5 years hands-on experience in advanced thin film deposition, characterization or related semiconductor field

• Expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes
• Strong understanding of film growth mechanisms, surface chemistry, and plasma physics
• Knowledge of thermodynamics, chemical kinetics, and reaction engineering
• Proficiency in DOE, SPC, and advanced statistical analysis
• Some Familiarity with TCAD or process simulation tools for film modeling
• Data analytics and machine learning for process optimization
• Hands-on experience with TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry, and other thin film metrology
• Advanced root-cause analysis and failure mode identification
• Ability to develop predictive models for process behavior

• Strong statistical analysis, communication, and problem solving skills.
• Experience in leading cross functional projects and mentoring junior engineers.
• Strong analytical and problem solving skills.
• Team player and self driver.

• People
  - Respect, develop, and empower others
• Innovation
  - Drive continuous improvement and breakthrough thinking
• Tenacity
  - Show grit and determination
• Collaboration
  - Build trust and foster teamwork
• Customer Focus
  - Deliver excellence and value
• Speed
  - Act with purpose and set the pace

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to…