Senior Process Engineer

Ang Mo Kio Industrial Park 2, Singapore | Posted on 05/29/2026

• Operate and optimize Photolithography equipment for ASML i-Line Stepper Systems
  , by defining and tuning process recipes (focus, exposure dose, alignment, etc.)
• Perform routine process monitoring and troubleshooting on ASML i-Line steppers, including tool qualification, SPC tracking, and defect analysis, ensuring stable and repeatable process performance.
• Analyze process and metrology data to identify improvement opportunities, drive root-cause analysis, and implement robust corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability.
• Assist in MEMS technology development, focusing on the setup and optimization of Photolithography, Screen Printing, and Bonding processes in a semiconductor environment.
• Assist in the development, characterization, and optimization of Photolithography, Screen Printing, and Bonding processes for semiconductor manufacturing.

• Monitor and control process to ensure consistent and high-quality output.
• Troubleshoot process issues and implement corrective actions.

• Maintain detailed documentation of process parameters, experiments, and results.
• Prepare technical reports and presentations to communicate findings and recommendations to the engineering team.
• Update process documentation and standard operating procedures (SOPs) as needed.

• Work closely with cross-functional teams, including R&D, production, and quality assurance, to ensure seamless integration of photolithography, screen printing and bonding processes.
• Participate in team meetings and contribute to problem-solving discussions.
• Provide support to shift engineers and shift technicians as required.
• Participate in continuous improvement initiatives to enhance process efficiency, yield, and quality.
• Identify opportunities for process automation and implement solutions.

• Bachelor’s degree in Electrical & Electronics, Mechatronics, Physics/Applied Physics, Materials Science, Chemical or Mechanical Engineering studies.

• Understanding of photolithography or bonding principle and semiconductor process. Knowledge of EKRA printing and bonding processes will be considered an advantage.
• Knowledge of data analysis and statistical process control.
• Hands‑on experience with photolithography equipment (Track: DNS/TEL, Stepper: Canon/ASML, Aligner: EVG/SUSS), Screen printing (EKRA) and Bonding (EVG) equipment is highly desirable.
• Good communication and teamwork skills.
• Work independently and able to do multitask effectively.