Snr​/Associate Equipment Engineer - Pre-assembly, Reconstitution

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

To identify equipment issues, drive yield/quality improvements, reduce costs, improve productivity, and assist team members.

• Perform set-up and conversion to support production.

• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.

• Determine methods and procedures independently and provide guidance to less experienced team members when required.

• Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists.

• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

• Diploma / ITC/NTC in Mechatronic, Mechanical Engineering, Physics, Electronics or equivalent

• 2 years of relevant experience in semiconductor are preferred.

• Experience with Wafer Saw, Backgrind & Laser Groove equipment will be an advantage

• Ability to work on 12 hours rotating shift