College Intern - Process development in PVD Ventura chambers TSV

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.

The work we do together advances the world’s technology.

Location:

Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible while learning every day in a supportive leading global company. Visit our Careers website to learn more.

• 1. With engineer’s guidance to perform, collect data and analyze on unusually complex experiments to develop the physical vapor deposition (PVD) product.
• 2. Job scope including
  • a) PVD process optimization & measure metal film properties, organize data/reports for review;
  • b) Perform hardware characterization on moderately difficult systems, within safety guidelines;
  • c) With engineer’s guidance, involve in troubleshooting moderately complex problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues
• Time Type:
  Full time
• Employee Type:
  Intern / Student
• Travel:
  No
• Relocation Eligible:
  No
• Location:
  
  Singapore,SGP

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.