Advanced Packaging Principle Integration Technologist; Principal Engineer

Work Your Magic with us!
Ready to explore, break barriers, and discover more? We know you’ve got big plans – so do we! Our colleagues across the globe love innovating with science and technology to enrich people’s lives with our solutions in Healthcare, Life Science, and Electronics. Together, we dream big and are passionate about caring for our rich mix of people, customers, patients, and planet.

That’s why we are always looking for curious minds that see themselves imagining the unimaginable with us.

Everything we do in Electronics is to help us deliver on our purpose of being the company behind the companies, advancing digital living. We are dedicated to being the trusted supplier of high- tech materials, services and specialty chemicals for the electronics, automotive and cosmetics industries. We foster a global collaborative organization made up of individuals who have the passion to win, obsess about the customer, are relentlessly curious and act with urgency.

Together, we push the boundaries of science to make more possible for our customers.

In this role, you will be instrumental in developing our Advanced Packaging opportunity definition, ecosystem engagement strategy, and program development. By connecting across key business unit partners and leveraging our core competencies, you will drive business and product development from idea to proof of concept for transfer to high-volume manufacturing.

The ideal candidate will combine deep equipment, process, and integration knowledge of Advanced Packaging technologies— including Wafer Level Packaging, Hybrid Bonding, Fusion Bonding, and adjacent technologies— with a vast ecosystem network of equipment suppliers, Integrated Device Manufacturer, Foundry, and Memory customers, as well as consortia partners.

• Through technical expertise, identify and stay ahead of key Advanced Packaging technology inflection points and roadmaps
• Through industry and ecosystem connections, continuously acquire in‑depth strategic knowledge of customer and Original Equipment Manufacturer(OEM) roadmaps
• Transfer knowledge and educate peers—both laterally and upward—on Advanced Packaging roadmaps
• Leverage industry knowledge to identify process, equipment, and integration challenges
• Work across business units and the Chief Technology Office to identify material solutions and developments that address industry challenges
• Leverage industry networks and connections to engage the ecosystem on collaborative development opportunities
• Apply deep technical knowledge to ensure development programs identify and meet industry‑standard datasets
• Ensure development programs leverage industry expertise to deliver relevant datasets in the most timely manner

Minimum Qualifications:

• Master of Science degree or higher in Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related engineering field
• 10 or more years of experience developing integration and process flows
• 10 or more years of hands‑on 300mm process and equipment R&D experience
• Experience as an Advanced Packaging 300mm Equipment Tool Owner
• Experience in Advanced Packaging Thin Film Deposition, Chemical Mechanical Planarization, Bonding, or Patterning process development
• 7 or more years of collaborative external business development experience
• Experience defining Scope of Work, Proof of Concept, and Design of Experiments for equipment and material definition

• 5 or more years of experience engaging with Advanced Packaging consortia— such as IMEC, ITRI, and A
  * STAR— including engagement model definition, Scope of Work development, and Proof of Concept execution
• Demonstrated ability to work effectively in highly ambiguous environments
• Demonstrated ability to work…