×
Register Here to Apply for Jobs or Post Jobs. X

Lead Embedded Hardware Engineer

Job in Knysna, 6570, South Africa
Listing for: University of Fort Hare
Full Time position
Listed on 2026-07-09
Job specializations:
  • Engineering
    Electronics Engineer, Hardware Engineer, Systems Engineer, Test Engineer
Job Description & How to Apply Below
Location: Knysna

Our client is seeking a Lead Embedded Hardware Engineer / Hardware Lead to design and develop a highly miniaturized, high-performance avionics hardware platform. The senior engineer will own the full hardware lifecycle from schematic design and PCB layout through prototyping, testing, and mass production.

You will be responsible for developing:

  • The Aero Node processing hub (STM
    32-based flight computation system)
  • The H1 headset electronics (wearable biometric and audio DSP system)
  • High-density, safety-critical embedded PCB systems for aviation applications
Required Experience & Skills
  • 5–7+ years in embedded hardware and PCB design
  • Strong experience with high-density, multi-layer PCB layout
  • Proven ability in high-speed digital design and signal integrity
  • Strong knowledge of STM
    32 microcontroller architecture
  • Experience with EMI-sensitive designs (GPS, magnetometers, RF systems)
  • Experience with wearable or rigid-flex PCB design
  • Demonstrated experience owning PCB development from concept, design, prototyping, validation, and miniaturised production
  • Ability to act as the final technical authority for hardware design decisions
  • Experience leading hardware development projects and mentoring junior engineers
  • Hands‑on hardware debugging capability
Advantageous (Bonus) Experience
  • Drone or aviation hardware experience (Pixhawk, Cube Pilot, FMUv6x)
  • Avionics, aerospace, or safety‑critical embedded systems
  • Experience with MRAM, eMMC, or high‑reliability storage systems
  • Familiarity with EKF‑based navigation or flight control systems
Key Responsibilities
  • End‑to‑end PCB design using Altium Designer or Ki Cad
  • Design of multi‑layer, high‑density embedded avionics hardware
  • Integration of sensors and modules including IMUs, barometers, magnetometers, GNSS, and wireless communication systems
  • High‑speed interface design (SPI, I2C, USB, SDIO) with strong signal integrity control
  • EMI/EMC mitigation, particularly for GPS and magnetometer performance
  • Design of rigid‑flex PCBs for wearable electronics
  • Collaboration with mechanical engineers on vibration, thermal, and enclosure design
  • Support prototyping, debugging, and validation using lab equipment (oscilloscopes, logic analysers)
  • Manage DFM/DFA and transition from prototype to production
  • Provide technical leadership and final sign‑off on hardware architecture, design reviews, and production readiness
Salary

Market related.

#J-18808-Ljbffr
Note that applications are not being accepted from your jurisdiction for this job currently via this jobsite. Candidate preferences are the decision of the Employer or Recruiting Agent, and are controlled by them alone.
To Search, View & Apply for jobs on this site that accept applications from your location or country, tap here to make a Search:
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary