Hybrid Thermal Design Lead — Electronics Packaging; Houston
Listed on 2026-10-11
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Engineering
Packaging Engineer, Systems Engineer
Hewlett Packard Enterprise in Texas (Spring) is seeking a Mechanical/ Thermal Design Engineer to lead multi-disciplinary teams in developing advanced hardware and packaging for servers. The role combines design, validation, and collaboration with internal and external partners to deliver robust solutions.
The candidate will have a Bachelor's or Master's in Mechanical Engineering and 6–10 years of experience in thermal solution design, CFD, and 3D CAD tooling, with strong communication skills.
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This posting is for the Hybrid Thermal Design Lead — Electronics Packaging (Houston) role at Hewlett Packard Enterprise, based in Spring, TX, United States.
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