Hybrid Hardware Mechanical Engineer II - Design & Thermal
Listed on 2026-10-21
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Engineering
Mechanical Engineer, Systems Engineer
Hewlett Packard Enterprise is seeking a Hardware Mechanical Engineer II to design mechanical and thermal hardware, electronics enclosures, and production tooling. This role emphasizes validation via tolerances, form/fit/function, and acoustics, with collaboration across internal and external teams.
Required are a Bachelors or Masters in Mechanical Engineering and 2–4 years of experience, with CREO and CFD/thermal analysis skills. Hybrid work arrangement with some in-office days.
This posting is for the Hybrid Hardware Mechanical Engineer II
- Design & Thermal role at Hewlett Packard Enterprise, based in Spring, TX, United States.
As a Hybrid Hardware Mechanical Engineer II
- Design & Thermal, you will play an important part at Hewlett Packard Enterprise in Spring, TX, United States.
We invite applications for the Hybrid Hardware Mechanical Engineer II
- Design & Thermal position located in Spring, TX, United States.
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